Alex Ochs
Education:
● Ph.D. in Electrical Engineering and Computer Science, Oregon State University, Corvallis, OR (2025.09 - Present)
● B.S. in Electrical and Computer Engineering, Oregon State University , Corvallis, OR (2020.09 - 2024.06)
Experience:
● Cloud Software Engineer, HP Inc., Corvallis, OR (2024.07 - 2025.08)
● Computer Vision Engineering Intern, HP Inc., Corvallis, OR (2023.06 - 2023.09)
● Firmware and Software Engineering Intern, Tesla, Palo Alto, CA (2021.01 - 2022.09)
Research Interests:
● Analog Computing and Compute-in-Memory Circuits and Architectures for future AI applications
Tien-Anh Nguyen
Education:
● Ph.D. in Materials Science, Oregon State University, Corvallis, OR (2024/09 - present) (Co-advised by Prof.Sieun Chae)
● M.S. in Nanoscience and Engineering, Inje Univeristy, South Korea (2021/03 - 2023/02)
● B.E. in Engineering Physics, Hanoi University of Science and Technology, Hanoi, Vietnam (2016/09 - 2021/02)
Experience:
● Materials Engineer Intern, VINFAST, Vietnam (2024/04 - 2024/07)
● Scientific Researcher, Sungkyunkwan University, South Korea (2023/03 - 2024/03)
Research Interests:
● Memristor Materials for In-Memory Computing
Tanay Chitre
Education:
● M.S in Electrical and Computer Engineering, Oregon State University, Corvallis, OR (2025.09 - Present)
● B.S in Electrical and Electronics Engineering & MSc. in Biological Sciences, Birla Institute of Technology and Sciences, Pilani (2018.09 - 2023.08)
Experience:
● Hardware Engineer, WCB Robotics, Hyderabad, India (2023-2025)
● Analog Test and Validation Intern, Texas Instruments, Bangalore, India (2022-2023)
Research Interests:
● Mixed Signal Circuits for Neuromorphic Applications
Daniel Zheng Fang
Education:
● Ph.D. in Electrical Engineering and Computer Science, Oregon State University, Corvallis, OR (Starting from 2026.09)
● M.S. in Electronic Engineering, Tsinghua University, Beijing, China (2023/09 - 2026/06)
● B.S. in Electronic Engineering, Tsinghua University, Beijing, China (2019/09 - 2023/06)
Research Interests:
● Computer Architecture, Algorithms, and Circuits for future AI applications